Analysis of airflow and heat within electronic device enclosures
Ventilation analysis was conducted using numerical simulation within the electronic device enclosure.
In the thermal airflow analysis of electronic device enclosures, we conducted ventilation analysis through numerical simulations within the enclosures. With the improvement of technology, electronic components are increasingly shrinking, making thermal issues within the enclosures unavoidable. The placement of high-heat-generating components and ventilation parts such as fans can significantly affect the performance of the devices themselves. We conducted the analysis to gain insights into this. For more details, please download the catalog.
- Company：環境シミュレーション
- Price：Other
